2010.12至今  清华大学材料学院副研究员

2009.03-2010.12  清华大学材料科学与工程系讲师

2007.04-2009.02  美国应用材料公司工艺工程师

IEEE会员

中国电子学会高级会员

本课题组研究新型电子封装材料和器件，涉及太阳能光伏材料、热电材料和器件、界面材料、磁性纳米材料。

科研项目：

主持北京市自然科学基金面上项目，2013-2015

主持国家自然科学基金青年基金，2012-2014

主持教育部回国留学人员启动基金，2012-2013

主持清华信息科学与技术国家实验室（筹）学科交叉基金，2012-2013

参与国家科技重大专项02，高密度三维系统级封装，2009-2012

主持“清华-大金”研究中心国际合作项目，热界面材料和焊接材料，2009-2015

主持清华大学自主科研青年基金 2010-2012

主持新型陶瓷与精细工艺国家重点实验室开放课题，2010-2011

主持清华大学骨干人才支持计划

毕业成员：

王保民（2010本科），李文凯（2011本科），Christian Ocier （2011 Visiting scholar），李端辉（2012本科），陈政（2013本科），杨野（2013本科），张睿（2013本科），李威（2014本科），周辰驿（2014本科），余晖（2012硕士），李燕秋（2012硕士），周阳（2014硕士），卢年端（2012博士后），周刚（2013博士后），杨栋华（2014博士后）

2010年电子封装技术与高密度封装国际会议的封装材料与工艺分会的共主席

2012年国际材料研究学会联盟—先进材料青年学者国际会议委员

BOOK CHAPTER:

D. Lee*, L. Li and S. X. Wang, “Embedded Inductors”, Materials for Advanced Packaging, Daniel Lu and CP Wong, Eds., Berlin, Germany: Springer, 459-480, 2009.

专利：

卢年端，李亮亮，蔡坚，李燕秋，Co-P薄膜的制备方法，专利号ZL201110092400.6，授权

李亮亮，卢年端，蔡坚，含Co基薄膜的凸点底部金属层与无铅焊点连接的方法，专利号ZL201110129670.X，授权

李亮亮，周阳，一种Seebeck系数测试装置，ZL201210473642.4，授权

PAPERS:

2015

1. W. Li, T. Wu, R. Jiao, B.-P. Zhang, S. Li, Y. Zhou, L. Li*, Effects of silver nanoparticles on the firing behavior of silver paste on crystalline silicon solar cells, Colloids and Surfaces A, vol. 466, 132-137,  2015.

2. D. Yang, J. Cai, Q. Wang, J. Li, Y. Hu and L. Li*, IMC growth and shear strength of Sn–Ag–Cu/Co–P ball grid array solder joints under thermal cycling, J Mater Sci: Mater Electron, DOI 10.1007/s10854-014-2489-7 .

3. Y. Lei, C. Zhen and L. Li*, Microwave properties of ferromagnetic nanowire arrays patterned with periodic and quasi-periodic structures, Journal of Applied Physics, accepted.

4. Y. Zhou, Q. Tan, J. Zhu, S. Li, C. Liu, Y. Lei and L. Li*, Thermoelectric properties of amorphous Zr？Ni？Sn thin films deposited by magnetron sputtering, Journal of Electronic Materials, accepted.

2014

1. Y. Zhou, L. Li*, Q. Tan and J.-F. Li, Thermoelectric properties of Pb-doped bismuth telluride thin films deposited by magnetron sputtering, Journal of Alloys and Compounds, vol. 590, 362-367, 2014.

2. Y. Zhou, D. Yang, L. Li*, F. Li and J.-F. Li, Fast Seebeck coefficient measurement based on dynamic method, Review of Scientific Instrument, vol. 85, 054904, 2014.

3.  R. Zhang, J. Cai, Q. Wang, J. Li, Y. Hu, H. Du and L. Li*, Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications, Journal of Electronic Packaging, vol. 136, 011012, 2014.

4. D. Yang, G. Yang, J. Cai, Q. Wang, Y. Hu, J. Li, and L. Li*, Reliability of Sn–Pb solder joints with Cu and Co–P surface finishes under thermal cycling, 2014 15th International Conference on Electronic Packaging Technology, 239-243, Aug., 2014.

5. Y. Wang, R. Zhang, J. Li, L. Li, and S. Lin*, First-principles study on transition metal-doped anatase TiO2, Nano research letters, vol. 9, 46, 2014.

2013

1. N. Lu, D. Yang and L. Li*, Interfacial reaction between Sn-Ag-Cu solder and Co-P films with various microstructures, Acta Materialia, vol. 61, no. 12, 4581-4590, July, 2013.

2. Y. Yang, L. Li* and W. Li, Plasmon absorption of Au-in-CoAl2O4 linear nanopeapod chains, Journal of Physical Chemistry C, vol. 117, no. 27, 14142–14148, 2013.

3. D. Yang, N. Lu and L. Li*, Wettability of Sn-Bi and Sn-Ag-Cu Lead-Free Solder Pastes on Electroplated Co-P Films, 63rd IEEE Electronic Components and Technology Conference, May, 1686-1691, 2013.

2012

1. H. Yu, L. Li*, T. Kido, G. Xi, G. Xu and F. Guo, Thermal and insulating properties of epoxy/aluminum nitride composites used for thermal interface material, Journal of Applied Polymer Science, vol. 124, no. 1, 669-677, April 2012.

2. H. Yu, L. Li*, Y. Zhang, Silver-nanoparticle based thermal interface materials with ultra-low thermal resistance for power electronics applications, Scripta Materialia, vol. 66, no. 1, 931-934, 2012.

3. N. Lu, J, Cai and L. Li*, Dependence of interfacial adhesion of Co-P film on its microstructure, Surface and Coatings Technology, vol. 206, 4822-4827, 2012.

4. Y. Li and L. Li*, Synthesis and magnetic anisotropy analysis of Co/Au multilayered nanowires, IEEE. Transactions on Magnetics, vol. 48, no.11, 3925-3928, 2012.

5. Y. Li, L. Li* and J. Cai, Dual-band noise suppressors based on Co/Au multilayered magnetic nanowires, IEEE. Transactions on Magnetics, vol. 48, no.11, 4398-4401, 2012.

6. D. Li, L. Li*, D.-W. Liu and J.-F. Li, Temperature dependence of the Raman spectra of Bi2Te3 and Bi0.5Sb1.5Te3 thermoelectric films, Physica Status Solidi Rapid Research Letters, vol. 6, no. 6, 268-270, 2012.

7. G. Zhou and L. Li*, Phonon thermal conductivity of GaN nanotubes, Journal of Applied Physics, vol. 112, 014317, 2012.

8. H. Yu, R. Zhang, L. Li*, X. Mao, H. Du, Silver-based Thermal Interface Materials with Low Thermal Resistance, 2012 International Conference on Electronic Packaging Technology and High Density Packaging, 410-413, Aug., 2012.

9. Z. Chen, Y. Li and L. Li*, Integrated microwave noise suppressor fabricated on magnetic/dielectric composite ceramic substrate, IMAPS/Acers 8th International CICMT conference and Exhibition (2012), April 16-19, 2012, Erfurt, Germany, 000208-000215.

2011

1. N. Lu, Y. Li, J. Cai and L. Li*, Synthesis and characterization of ultrasonic-assisted electroplated Co-P films with amorphous and nanocrystalline structures, IEEE Transactions on Magnetics, vol. 47, no. 10, 3799-3802, Oct., 2011.

2. H. Yu, L. Li* and L. Qi, Viscosity and thermal conductivity of alumina microball/epoxy composites, 2011 International Conference on Electronic Packaging Technology and High Density Packaging, 387-390, Aug., 2011.

3. Y. Zhang, H. Yu and L. Li*, Synthesis and low-temperature sintering of tin-doped silver nanoparticles, 2011 International Symposium on Advanced Packaging Materials, 209-212, Oct., 2011.

4. Y. Li, Z. Chen, L. Li* and J. Cai, 20 gigahertz noise suppressor based on ferromagnetic nanowire arrays, 2011 International Symposium on Advanced Packaging Materials, 94-98, Oct., 2011.

2010

1. D.-W Liu, J.-F. Li*, C. Chen, B.-P. Zhang and L. Li, Fabrication and evaluation of microscale thermoelectric modules of Bi2Te3-based alloys, Journal of Micromechanics and Microengineering, vol. 20, no. 12, 125031-1-6, Nov., 2010.

2. B. Wang and L. Li*, Numerical simulation on the noise suppression effect of nanogranular magnetic film CoFeHfO on PCB transmission lines, 2010 International Conference on Electronic Packaging Technology and High Density Packaging, 582-586, Aug., 2010.

3. Y. Li, L. Li* and J. Cai, Multi-pulse electrodeposition of soft magnetic thin film Co-P for embedded inductor application, 2010 International Conference on Electronic Packaging Technology and High Density Packaging, 220-224, Aug., 2010.

4. H. Yu, L. Li*, T. Kido and G. Xi, Dielectric composite material with enhanced thermal conductivity used for electronic packaging, 2010 International Conference on Electronic Packaging Technology and High Density Packaging, 258-262, Aug., 2010.

2009

1. L. Li*, D. W. Lee, K. Hwang, Y. Min, T, Hizume, M. Tanaka, M. Mao, T. Schnieder, R. Bubber and S. X, Wang, Small-resistance and high-quality-factor magnetic integrated inductors on PCB, IEEE Transactions on Advanced Packaging, vol. 32, no. 4, 780-787, Nov., 2009.

2. L. Li*, D. W. Lee, K. Hwang, Y. Min and S. X. Wang, On-package magnetic materials for embedded inductor applications, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, 471-474, Aug., 2009. (Best paper award)

2007

1. L. Li*, D. W. Lee, M. Mao, T. Schnieder, R. Bubber, K. Hwang, Y. Min, and S. X. Wang, High-frequency responses of granular CoFeHfO and amorphous CoZrTa magnetic materials, Journal of Applied Physics, vol. 101, no. 12, 123912-1-4, June, 2007. (SCI=2.2)    11

2. L. Li*, D. W. Lee, S. X. Wang, K. Hwang, Y. Min, M. Mao, T. Schnieder and R. Bubber, Tensor nature of permeability and its effects in inductive magnetic devices, IEEE Transactions on Magnetics, vol. 43, no. 6, 2373-2375, June, 2007.

2006

L. Li*, S. X. Wang, K. Hwang, Y. Min, M. Mao, T. Schnieder and R. Bubber, Package-compatibility and substrate dependence of granular soft magnetic material CoFeHfO developed by reactive sputtering, Journal of Applied Physics, vol. 99, no. 8, 08M301-1-3, April, 2006.

2005

L. Li*, A. M. Crawford, S. X. Wang, A. F, Marshall, M. Mao, T. Schnieder and R. Bubber, Soft magnetic granular material Co-Fe-Hf-O for micromagnetic device applications, Journal of Applied Physics, vol. 97, no. 10, 10F907-1-3, May, 2005.

2001

L. Li, Y. An* and C. Ying, Experimental parameters and the stability of sonoluminescing bubbles, Chinese Physics Letters, vol. 18, no.11, 1523-1526, Nov., 2001.

招聘信息

本课题组招收博士后、研究生、本科生若干名，从事太阳能光伏材料、微型器件等方面的研究。有意者可以将简历发到liliangliang@mail.tsinghua.edu.cn 。